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Electronic Skin

Speaker:  Prof. Ravinder Dahiya

Venue: CeNSE Seminar Hall

Over the last 50 years, the miniaturization led advances in microelectronics have revolutionized our lives through fast computing and communication. Recent advances in the field, pursued through More than Moore technology, are propelled by applications such as robotics, wearable systems, and healthcare. Often, these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper and with features such as flexibility and stretchability. This lecture will present various approaches (over different time and dimension scales) which are being explored to obtain electronics and sensors distributed on flexible and conformable substrates, especially in context with tactile or electronic skin for robots and wearable systems. The lecture will begin by highlighting the advances in e-skin technology with off-the-shelf sensors and electronic components on flexible printed circuit boards. This will be followed by recent advanced alternatives that are based on printed silicon nanowires, graphene and ultra-thin chips. The sensitive electronics systems will underpin advances in numerous emerging fields such as internet of things, smart cities and mobile health etc. and this lecture will also discuss how the flexible electronics research may unfold in the future.

Ravinder Dahiya is Professor of Electronics and Nanoengineering and EPSRC (Engineering and Physical Science Research Council) Research Fellow in the School of Engineering at University of Glasgow, UK. He is the Director of Electronics Systems and Design Centre (ESDC) and the leader of Bendable Electronics and Sensing Technologies (BEST) group. His group conducts fundamental research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems. 

His multidisciplinary research interests include Flexible and Printable Electronics, Electronic Skin, Robotic Tactile Sensing, and Wearable Electronics. He has published more than 180 research articles, 4 book (3 at various publication stages) and 10 patents (including 7 submitted). He has led many international projects funded by European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council.

He is a Distinguished Lecturer of IEEE Sensors Council and is on the Editorial Boards of Scientific Reports (Nature Group) and IEEE Sensors Journal. He has been guest editor of 6 Special Journal Issues. He was General Chair of IEEEPRIME 2015 and is the Technical Program Co-Chair (TPC) for 2017 and 2018 IEEE Sensors Conferences in Glasgow and N. Delhi respectively. 

Professor Dahiya holds prestigious EPSRC Fellowship. In past, he received Marie Curie Fellowship and Japanese Monbusho Fellowship. He has received several awards and the most recent ones are the 2016 IEEE Sensor Council Technical Achievement Award, and the 2016 Microelectronic Engineering Young Investigator Award, (Elsevier). In 2016, he was included in list of Scottish 40UNDER40. 

Personal website: 
Twitter: @RavinderSDahiya
TEDx talk: ‘Animating the Inanimate World’ (

Friday, 24 November 2017 - 10:30am