Courses
NE 222 (AUG) 3:0
MEMS: Modeling, Design, and Implementation
This course discusses all aspects of MEMS technology – from modeling, design, fabrication, process integration, and final implementation. Modeling and design will cover blockset models of MEMS transducers, generally implemented in SIMULINK or MATLAB. Detailed multiphysics modeling may require COMSOL simulations. The course also covers MEMS specific micromachining concepts such asbulk micromachining, surface micromachining and related technologies, micromachining for high aspect ratio microstructures,glass and polymer micromachining, and wafer bonding technologies. Specific case studies covered include Pressure Sensors, Microphone, Accelerometers, Comb-drives for electrostatic actuation and sensing, and RF MEMS. Integration of micromachined mechanical devices with microelectronics circuits for complete implementation is also dicussed. G.K.Ananthasuresh, K.J.Vinoy, S. Gopalakrishnan, K.N.Bhat and V.K.Aatre. “Micro and Smart Systems- Technology and Modelling” John Wiley & Sons, Inc (2012),Marc J. Madou, "Fundamentals of Microfabrication and Nanotechnology - Volume II" CRC Press (2012) Chang Liu, “Foundations of MEMS” Pearson Education International (2006),Stephen D. Senturia, “Microsystem Design”, Kluwer Academic Publishers, 2001
NE 223 (JAN) 2:1
Analog Circuits and Embedded System for Sensors
The Internet of Things (IoT) revolution is driven by confluence of high performance sensors, powerful computation power of microcontrollers and wireless technology. The performance of sensors is not only governed by inherent characteristics of sensor such as sensitivity, linearity and response time but also the front end interfacing analog circuit and backend processing in digital domain. The goal of this course is to explore the electronics that needs to be incorporated to create sensor systems and to learn the trade-offs in design of circuits to maximize performance subject to real life design constraints.
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Micro Electro Mechanical Systems (IEEE MEMS 2022)
The 35th International Conference on
Micro Electro Mechanical Systems
(IEEE MEMS 2022)
Conference Chairs:
Zhihong Li - Peking University, China
Shuji Tanaka - Tohoku University, Japan
Location:
Tokyo International Forum
5-1 Marunouchi 3-chome,
Chiyoda-ku, Tokyo 100-0005, Japan