The Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc) is organising an advanced workshop on metrology and nano-characterisation techniques, welcoming participants from academia, industry and start-ups. The programme is designed to develop practical, instrument-level proficiency in electrical, optical, structural and chemical characterisation methods that are fundamental to contemporary materials science, semiconductor processing and device development.

 Delivered by CeNSE's expert scientific, and facility staff at the Micro and Nano Characterization Facility (MNCF), the programme integrates theory sessions with extensive practical laboratory experience utilising state-of-the-art instrumentation.

 Over a four-day period, participants will have engaging learning with probe stations, electron microscopes, ion-beam systems and a broad range of spectroscopy and diffraction instruments, acquiring practical, instrument-level understanding that cannot be achieved through classroom instruction alone. Whether you are a researcher, an industrial engineer or a startup founder developing deep-tech hardware, this workshop provides a unique opportunity to train on national-facility characterisation infrastructure.

• 4-day, fully hands-on training with a theory + lab format for every module
• Direct instrument time on SEM, TEM, FIB, AFM, XPS, XRD, Raman, FTIR, UV-Vis, MSA and DC probe stations
• Training will be given by MNCF scientific/technical staff at IISc Bengaluru
• Open to academia, industry professionals, and startups — small-batch, application-focused format

This training programme provides engineers with a practical understanding of the principal metrology and characterisation techniques employed in micro- and nanofabrication which can be applied in various branches of science and technology. Each module combines a theoretical lecture with a practical laboratory session, enabling participants to acquire both an understanding of the underlying physics and operational experience with the relevant instrumentation.

Duration: 4 days, approximately 8 contact hours per day.

Learning Outcomes:

• Analyze and interpret electrical characterization data acquired through guided demonstrations on DC probe stations.
• Evaluate surface morphologies and dynamic responses utilizing Atomic Force Microscopy (AFM) and Micro Systems Analyzer (MSA).
• Interpret chemical, optical, and structural properties by exploring analytical workflows across XPS, XRD, Raman, FTIR, and UV-Visible spectroscopy platforms.
• Comprehend advanced imaging workflows at the micro- and nano-scale via Scanning and Transmission Electron Microscopy (SEM/TEM).
• Assess internal material and device architectures through site-specific milling and cross-sectioning demonstrations on Focused Ion Beam (FIB) systems.

Who should Attend:

• Faculty, postdocs, and research scholars from academic and R&D institutions
• Process, product, and device engineers from industry who are interested to develop understanding on characterization/metrology
• Founders and engineers from deep-tech / hardware startups needing hands-on exposure to advanced micro/nano characterization tools