VISITING PROFESSOR

Krishnan Shrinivasan

Krishnan Shrinivasan

Visiting Professor

Room No: TF 02
Email: krishnans@iisc.ac.in
Phone: +91 80 22933323(402)
Education
• MS in Mechanical Engineering, 1984, Clemson University, Clemson, SC
• BE (Hons.) in Mechanical Engineering, 1982, University of Madras(REC TRICHY), Madras, India.

Experience
• Visiting Professor, CeNSE, IISc., Bangalore, (since Jan 2025).
• Vice-President & Managing Director, Lam Research (India) Pvt. Ltd. (2016-2023).
• Sr. Director, Systems Engineering, Lam Research (India) Pvt. Ltd., (2008 – 2016).
• Director, SIG Business Unit Operations, (2006 – 2008).
• Sr. Manager, New Product Development (2000 – 2006).
• Engineering Manager, R&D, (1998 – 2000).
• Sr. Mechanical Engineer, (1995 – 1998).
• Co-founder & Partner, Dextra Systems, Berkeley, CA, (1993 – 1996).
• Sr. Mechanical Design Engineer, Synthetica Technologies, Inc., Richmond, CA, (1993 -1995).
• Systems Engineering Manager, Aquanautics Corporation, Alameda, CA, February (1988 -1993).
• Instruments Manager, Serata Geomechanics, Inc., Richmond, CA, (1984 – 1988).

Research Interests
• Semiconductor Equipment design and technology.
• Specialist in commercializing innovative new technologies for semiconductor wafer processing.

Patents
• Method and apparatus for removing post-etch residues and other adherent matrices, Vladimir Starov, Syed Basha, Krishnan Shrinivasan, Karen Reinhardt, Aleksandr Kabansky, U.S. Patent Application No. 09/397,956, U.S. Patent No. 6,228,563.

• Method and apparatus for removing post-etch residues and other adherent matrices, Vladimir Starov, Shmuel Erez, Syed Basha, Arkadiy Shimanovich, Ravi Vellanki, Krishnan Shrinivasan, Karen Reinhardt, Aleksandr Kabansky, U.S. Patent Application No. 09/630,231, U.S. Patent No. 6,333,268.

• Apparatus for maintaining wafer back-side and edge exclusion during supercritical fluid processing, Sanjay Gopinath, Patrick Vancleemput, Francisco Juarez, Krishnan Shrinivasan, U.S. Patent Application No. 10/011,499, U.S. Patent No. 6,550,484.

• Measurement of substrate temperature in a process chamber using non-contact filtered infrared pyrometry, Krishnan Shrinivasan, Arkadiy Shimanovich, and Prasad Gadgil, U.S. Patent Application No. 09/997,870, U.S. Patent No. 6,563,092.

• Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials, Patrick Joyce, Adrianne Tipton, Krishnan Shrinivasan, Dennis Hess, Satyanarayana Myneni, Galit, Levitin, U.S. Patent Application No. 10/303,321, U. S. Patent No. 6,764,552

• Method for removing photoresist and post-etch residue using activated peroxide followed by supercritical fluid treatment, Adrianne Tipton, Patrick Joyce, Raashina Humayun, and Krishnan Shrinivasan, U.S. Patent Application No. 10/159,951, U.S. Patent No. 6,800,142

• Method and apparatus for removing photoresist and post-etch residue from semiconductor substrates by in-situ generation of oxidizing species, Krishnan Shrinivasan and Adrianne Tipton, U.S. Patent Application No. 10/128,899, U.S. Patent No. 6,848,455

• Apparatus and methods for processing semiconductor substrates using supercritical fluids, Krishnan Shrinivasan, Souvik Banerjee, Francisco Juarez, Karen Reinhardt, and Sanjay Gopinath, U.S. Patent Application No. 10/067,520, U.S. Patent No. 6,848,458

• Method and apparatus for using surfactants in supercritical fluid processing of wafers, Raashina Humayun, Patrick Joyce, Adrianne Tipton, Krishnan Shrinivasan, Dennis Hess. Satyanarayana Myneni, Souvik Banerjee, U.S. Patent Application No. 10/306,677, U.S. Patent No. 6,905,566

• Method and apparatus for sealing substrate load port in a high pressure reactor, Krishnan Shrinivasan, Arkadiy Shimanovich, and Vladimir Starov, U.S. Patent Application No. 10/007,227, U.S. Patent No. 7,105,061

• Cast pedestal with heating element and coaxial heat exchanger, Krishnan Shrinivasan, Stephen Gentile, Peter Woytowitz, Sassan Roham, George Kamian, U.S. Patent Application No. 11/184,101, U.S. Patent No. 7,327,948

• Apparatus and methods for processing semiconductor substrates using supercritical fluids, Krishnan Shrinivasan, Souvik Banerjee, Francisco Juarez, Karen Reinhardt, Sanjay Gopinath, U.S. Patent Application No. 10/031,371, U.S. Patent No. 7,503,334

• Pedestal heat transfer and temperature control, Krishnan Shrinivasan, Stephen Gentile, Peter Woytowitz, Sassan Roham, George Kamian, Michael Rivkin, U. S. Patent Application No. 11/851,310, U.S. Patent No. 7,941,039

• Method and apparatus for single-chamber sequential curing of semiconductor wafers, Krishnan Shrinivasan, Feng Wang, George Kamian, Stephen Gentile, Mark Yam, U.S. Patent Application No. 11/115,576, U.S. Patent No. 8,137,465

• Multi-station sequential curing of dielectric films, Krishnan Shrinivasan, Michael Rivkin, Eugene Smargiassi, Mohamed Sabri, U.S. Patent Application No. 11/688,695, U.S. Patent No. 8,454,750

• Multi-station sequential curing of dielectric films, Krishnan Shrinivasan, Michael Rivkin, Eugene Smargiassi, Mohamed Sabri, U.S. Patent Application No. 13/886,694, U.S. Patent No. 8,629,068

• Method for reducing stress in porous dielectric films, Maxim Kelman, Krishnan Shrinivasan, Feng Wang, Victor Lu, Sean Chang, Guangquan Lu, U.S. Patent Application No. 11/369,311, U.S. Patent No. 8,889,233

• Single-chamber sequential curing of semiconductor wafers, Krishnan Shrinivasan, Feng Wang, George Kamian, Steve Gentile, Mark Yam, U.S. Patent Application No. 13/370,579, U.S. Patent No. 8,951,348

• Multi-station sequential curing of dielectric films, Jason Haverkamp, Dennis Hausmann, Kevin McLaughlin, Krishnan Shrinivasan, Michael Rivkin, Eugene Smargiassi, Mohamed Sabri, U.S. Patent Application No. 11/977,792, U.S. Patent No. 8,980,769

• Systems for uniform heat transfer including adaptive portions, Keerthi Gowdaru, Krishnan Shrinivasan, U.S. Patent Application No. 13/730,605, U.S. Patent No. 9,835,388

• Multi-station sequential curing of dielectric films, Jason Haverkamp, Dennis Hausmann, Kevin McLaughlin, Krishnan Shrinivasan, Michael Rivkin, Eugene Smargiassi, Mohamed Sabri, U.S. Patent Application No. 14/593,046, U.S. Patent No. 9,873,946