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Anodization of sputtered metallic films: The microstructural connection

TitleAnodization of sputtered metallic films: The microstructural connection
Publication TypeJournal Article
Year of Publication2015
AuthorsChoudhury, TH, Raghavan, S
JournalScripta Materialia
KeywordsAnodization, Growth stress, Microstructure, Next article in issue Keywords Sputtering, Previous article in issue

A simple microstructural rationale for successful anodization of metallic films into ordered oxide nanostructures has been identified. It applies to three of the most commonly studied systems, Zr, Ti and Al films and can be extended to other such oxides. A dense Zone T or II microstructure, in sputtered films, is the most critical ingredient. While Tsubstrate > 0.3Tmelting is the simplest route, pressure and plasma heating can also be exploited. Such microstructures are also associated with a unique growth stress signature.