Sorry, you need to enable JavaScript to visit this website.
office.cense@iisc.ac.in | +91-80-2293 3276/ +91-80-2293 3291 | Sitemap

Design and Electrical Characterization of Wafer-level Micro-package for GaAs-based RFMEMS Switches

TitleDesign and Electrical Characterization of Wafer-level Micro-package for GaAs-based RFMEMS Switches
Publication TypeJournal Article
Year of Publication2013
AuthorsChaturvedi, S, Saravanan, SG, Bhat, MK, Bhalke, S, Badnikar, SL, Muralidharan, R, Koul, SK
JournalIETE Journal of Research
Volume59