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Fabricating Capacitive Micromachined Ultrasonic Transducers with Wafer Bonding Technique

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TitleFabricating Capacitive Micromachined Ultrasonic Transducers with Wafer Bonding Technique
Publication TypeJournal Article
Year of Publication2008
AuthorsArora, A, Gopal, R, Dwivedi, VK, Shekar, C, Ahmad, B, Pratap, R, George, PJ
JournalJournal of Sensors & Transducers
Volume93
Pagination15–20
Research Area: 
MEMS/NEMS